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  november 2006 rev 3 1/7 7 TDA7519 multichip module for car radio applications features high-performance signal processor for car radio applications adjustment-free stereo decoder fm noise blanker programmable multipath detector 2 stereo and 2 mono inputs with mixing capability bass, treble and loudness controls 4 independent speaker outputs high-performance fully digital rds demodulator on-chip adjustment-free 57khz 8th order bandpass filter ari (sk indication) and rds signal quality output full i 2 c-bus control description the TDA7519 multichip module combines in a single compact (10x10mm) 44-pin package, the signal processing functionalities of a state-of-the- art car radio, with a minimized number of required external components. two devices are included: tda7460n, and tda7479. (please refer to the relevant datasheet for specifications) tda7460n is a digitally controlled stereo decoder and audioprocessor, featuring fm noise blanking and multipath detector; bass, treble, loudness controls with 2 stereo and 2 mono mixable inputs and four independent speaker outputs. tda7479 is a fully digital rds data decoder with an on-chip adjustment-free bandpass filter. both chips are i 2 c bus controlled. lqfp44 order codes part numbers package packing TDA7519 lqfp44 (10x 10x 1.4mm) tray TDA7519tr lqfp44 (10x 10x 1.4mm) tape and reel www.st.com
pin description TDA7519 2/7 1 pin description figure 1. pin connections 1 23 4 5 67 8 9 10 11 25 24 23 22 21 20 19 18 17 16 15 14 13 12 44 43 42 41 40 39 38 37 36 35 33 32 31 30 29 28 27 26 34 d06at549 cdr cdgnd cdl phone nc am mpx level smute nc cassl cassr nc cref outlf outrf outlr outrr vs gnd tm fsel filout ari osel nc gnd mpx vref nc scl sda nc rdda qual rdcl t57 nc oscout oscin vs extres phgnd nc table 1. pin description TDA7519 audioprocessor rds decoder name function tda7460n tda7479 1 3 cdr cd right channel input 2 4 cdgnd ground reference cd 3 5 cdl cd left channel input 4 6 phgnd phone ground (mpout selectable by sw) 5 7 phone phone input (mpin selectable by sw) 6 not connected 7 8 am am input 8 not connected 9 9 mpx fm input (mpx) 10 10 level level input stereo decoder 11 11 smute soft mute drive 12 12 scl i 2 c clock line 13 not connected 14 3 vref reference voltage 15 4 mpx rds input signal 16 5 osel oscillator selector pin
TDA7519 pin description 3/7 17 6 gnd ground 18 not connected 19 7 ari output for ari indication 20 8 filout filter output 21 9 fsel frequency selector 22 10 tm test mode enable 23 11 extres reset 24 12 vs supply voltage 25 13 oscin oscillator input 26 14 oscout oscillator output 27 not connected 28 15 t57 test output: 57khz clock 29 16 rdcl rds clock output 1187.5hz 30 1 qual signal quality indication 31 2 rdda rds data output 32 not connected 33 13 sda i2c data line 34 14 gnd supply ground 35 15 vs supply voltage 36 16 outrr right rear speaker output 37 17 outlr left rear speaker output 38 18 outrf right front speaker output 39 not connected 40 19 outlf left front speaker output 41 20 cref reference capacitor pin 42 not connected 43 1 cassr cassette input right 44 2 cassl cassette input left table 1. pin description (continued) TDA7519 audioprocessor rds decoder name function tda7460n tda7479
electrical specifications TDA7519 4/7 2 electrical specifications 2.1 thermal data table 2. thermal data symbol parameter test condition min typ max units r th thermal resistance junction to ambient, soldered on multilayer pcb 40 c/w t amb operating temperature range -40 85 c t stg storage temperature range -55 150 c
TDA7519 package information 5/7 3 package information in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. figure 2. lqfp44 (10x10) mechanical data and package dimensions. outline and mechanical data dim. mm inch min. typ. max. min. typ. max. a 1.60 0.063 a1 0.05 0.15 0.002 0.006 a2 1.35 1.40 1.45 0.053 0.055 0.057 b 0.30 0.37 0.45 0.012 0.015 0.018 c 0.09 0.20 0.004 0.008 d 11.80 12.00 12.20 0.464 0.472 0.480 d1 9.80 10.00 10.20 0.386 0.394 0.401 d3 8.00 0.315 e 11.80 12.00 12.20 0.464 0.472 0.480 e1 9.80 10.00 10.20 0.386 0.394 0.401 e3 8.00 0.315 e0.80 0.031 l 0.45 0.60 0.75 0.018 0.024 0.030 l1 1.00 0.039 k 0?(min.), 3.5?(typ.), 7?(max.) ccc 0.10 0.0039 lqfp44 (10 x 10 x 1.4mm) 0076922 e
revision history TDA7519 6/7 4 revision history table 3. document revision history date revision changes 01-oct-2006 1 initial release. 15-may-2006 2 migrate from stpress. 27-nov-2006 3 addition of pin diagram, package changed, layout changes, modify text.
TDA7519 7/7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2006 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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